Product Overview
Our Custom Die-Cut Nano Carbon Copper Foil Tape is a high-performance solution designed for modern electronics. By combining the excellent electrical conductivity of copper foil with the superior thermal emissivity of nano-carbon coating, this tape provides a dual-action benefit: effective EMI shielding and rapid heat dissipation. It is an ideal thermal management material for LFP battery packs, smartphones, and high-density electronic assemblies.
Key Features
Dual Functionality
Simultaneously handles electromagnetic interference (EMI) and thermal hotspots in compact spaces.
High Thermal Conductivity
The nano-carbon layer enhances heat radiation, significantly lowering the operating temperature of electronic components.
Precision Die-Cutting
Our advanced CNC and laser cutting technology ensure that the tape is cut to your exact dimensions with tight tolerances.
Excellent Adhesion
Equipped with high-performance conductive or non-conductive adhesive that maintains stability under high-temperature environments.
Technical Specifications
| Feature | Specification |
| Carrier Material | Copper Foil + Nano Carbon Coating |
| Total Thickness | Custom (e.g., 0.03mm - 0.15mm) |
| Thermal Conductivity | Up to 400 W/m·K (Vertical) / 1500+ (Horizontal) |
| Shielding Effectiveness | 70dB - 90dB |
| Surface Resistance | ≤0.05Ω |
Applications
LFP Battery Packs : Thermal leveling between cells and EMI protection for BMS.
Consumer Electronics : Heat dissipation for CPU/GPU in laptops and tablets.
LED Displays: Rapid cooling for high-power LED modules.
Telecommunications : Signal integrity and cooling for 5G base station components.
